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Information for Contact Mating Area Plating Material
Contact Codes for XRJB, XRJC, XRJD, XRJDB, XRJF, XRJH, XRJG, XRJM, XRJS, XRJV, XUSB
Contact Mating Area Plating Material Codes are listed below.
15u' = Code 1
30u' = Code 2
50u' = Code 3
6u' = Code 4
3u' = Code 5
(u'= micron)
Solder Area
Gold Flash = Code G
Tin = Code T
Gold and Tin = Z
Contact Material = Phosphor Bronze
Note: Reveiw product series part numbering system for location of the code. Part Numbering Systems
Contact Codes for XMG-P, XMG-J, XMH-P, and XMH-J
0¡GF£g 1: 6£g 2: 15£g 3: 30£g 5: 50£g 6¡G3£g
Note: For all other Series Numbers please check the drawing.
Gold Plating Thickness
Gold plating is a method of depositing a thin layer of gold onto the surface of the connector contact (metal), by electrochemical plating. Some of the industry codes used in the connector industry for different degress of plate thickness are listed below.
Selective Gold Plating - Industry S(x) Codes
