Xmultiple - Information for Lead Free Solder Processes

 

Wave solder capable to 240¢XC

Temperatures up to 240¢XC may be used in Wave solder process per Xmultiple Technologies spec in the last three letters of the Xmultiple part number. Please review the part numbering description for your product series - Product Number System Information.

Wave solder capable to 265¢XC

Temperatures up to 265¢XC may be used in Wave solder process per Xmultiple Technologies spec in the last three letters of the Xmultiple part number. Please review the part numbering description for your product series - Product Number System Information.

Reflow solder capable to 245¢XC

Temperatures up to 245¢XC may be used in Reflow solder process per Xmultiple Technical spec displayed in the last three number of the part number. Please review the part numbering description for your product series - Product Number System Information.

Reflow solder capable to 260¢XC

Temperatures up to 260¢XC may be used in Reflow solder process per Xmultiple Technical spec displayed in the last three number of the part number. Please review the part numbering description for your product series - Product Number System Information.

Eliminate Potential of Solder Bridges

If your wave soldering process during assembly results in solder bridges between two pins, adding more flux and reflowing often takes care of it. If not use a solder wick to remove just enough to break the bridge and re-flow. Because there's no hole to fill, SMT components don't need that much solder to make a joint. If the lead and the pad are both wetted, and there's even the slightest bead between them, it's good enough.

We would like to also suggest a good prevention method. Consider a good solution during your board layout to solve potential solder bridging problems . During the layout to of the blank PCB have the CAD/CAM designer cut 2mm solder pads which will preventing solder bridging problem or mask 2mm painting on both side of solder pad during the assembly process.

 

 

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