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Xmultiple Design Center

Xmultiple provides assistance with your connector and component design requirements. Our engineers assist our customers with their future product development, design, engineering, manufacturing, and product fulfillment with immense 'in-house' capabilities. Xmultiple has the ability to take an idea and turn it into a reality faster and more cost effectively than any other interconnect solutions Company. The 3D rendering above is our RJ45 and Dual USB (Type A) combination connection which is also integrated with a MicroSD card reader which is an Xmultiple patent pending technology. The MicroSD connector optionally can be positioned vertically to the right or left side of the RJ45 connector. New ideas like our RJ45/MicroSD combo connectors (X-SMART) can be created in a short amount of time for your company as well.

X-SMART- USB Connector Series. Xmultiple X-SMART-USB combo USB connector and a MicroSD card connector integrated in one small form factor. This connector is available in standard A and B, mini and micro USB connector types.

We have highly talented staff, and manufacturing facilities worldwide which provide our customers with over 30 years' experience. Our 4,978,317 patent for RJ connectors with integrated lights has become the standard for RJ connectors. Xmultiple provides many tools for you to use to assist in your product design and choices to move those products to market. Listed below are design tools and the links to each tool.

 

Xmultiple Product Drawings

Xmultiple provides customer drawings for each part we manufacture. In the event of a conflict between the specification in a product sheet and the customer drawing, the customer drawing takes precedence.

Xmultiple Guidelines for Printed Circuit Board Lay-Out

Xmultiple drawings provide the dimensions for printed circuit board lay-out for our modular jacks and contact array. When Side Entry or Contact Arrays are to be used it is required to place gold plated finger tips on the printed circuit board. When the free end part of the contacts attach directly on the printed circuit board, all through holes must be placed beyond the gold plated finger tips of the printed circuit board. The through holes must completely cover the solder mask rosin. Avoid that tin, flux or any fluid can reach the finger tips where electrical contact is established.

Xmultiple Guidelines for Panel Cut-Out Design

Side Entry Jack panel stops are to mechanical layouts which lean against the inner side of the wall where it is to be mounted. This panel cut-out is to prevent the pull forces which will be produced by the modular plug once it is inserted. This cut-out on the inner side of the wall will reduce the loosening of the contacts from the modular jack and also reduce the stress which will be exerted upon the solder joints.

This cut-out applies to any application where Contact Arrays are to be used. When a modular plug is inserted the housing where the contact array is mounted has to prevent damage on the solder joints.

 

IBIS Modeling and System Integrity Overviews - Xmultiple assist with your modeling and sumulation needs.

IBIS Modeling Information

System Integrity Overview

System Integrity Simulation and Requirements

 

 

SPICE Simulation - (Simulation Program with Integrated Circuit Emphasis).

SPICE Simulation

 


S-Parameters - Provides Electrical Properties Of An Interconnect - a Connector, a Scope Probe, a Circuit-Board Trace, a Circuit Board Via, or a Cable Contained in the Interconnect.

S-Parameters Interconnect Properties

 

 

Vector Network Analyzers (VNAs) - Analysis of Circuits

  • Network Analyzers Are Manufactured By Many Companies
  • Scattering Parameters (S-Parameters)
  • Best Practices for VNA Accuracy
  • VNA Calibration Techniques
  • ELinear VNA Measurements
  • Reflection Coefficient
  • Transmission Coefficient
  • Group Delay
  • Time-Domain Measurements

One of the most common measuring tasks in RF engineering is the analysis of circuits, from simple filters and amplifiers to complex satellite communication modules. As an extremely versatile test instrument, a VNA is the ideal equipment for quickly and precisely uncovering signal integrity problems, such as reflections and crosstalk.

This primer describes the fundamentals of vector network analysis, as well as practical instructions for improving accuracy, performing calibration, and making typical linear and time-domain measurements.

 

 

Electronic Design Tools- Models

Electronic Design Automation - EDA

EDA Program with integrated Schematic Capture, PCB layout and 3D modeling
Electronic design automation (EDA or ECAD) is a category of software tools for designing electronic systems such as printed circuit boards and integrated circuits. The tools work together in a design flow that chip designers use to design and analyze entire semiconductor chips.

EDA specifically with respect to integrated circuits.

EDA for electronics has rapidly increased in importance with the continuous scaling of semiconductor technology. Some users are foundry operators, who operate the semiconductor fabrication facilities, or "fabs", and design-service companies who use EDA software to evaluate an incoming design for manufacturing readiness. EDA tools are also used for programming design functionality into FPGAs.


Design

1. High-level synthesis (syn. behavioral synthesis, algorithmic synthesis) For digital chips

2. Logic synthesis translation of abstract, logical language such as Verilog or VHDL into a discrete netlist of logic-gates

3. Schematic Capture For standard cell digital, analog, rf like Capture CIS in Orcad by CADENCE and ISIS in Proteus

4. Layout like Layout in Orcad by Cadence, ARES in Proteus

Simulation

1. Transistor simulation V low-level transistor-simulation of a schematic/layout's behavior, accurate at device-level.

2. Logic simulation V digital-simulation of an RTL or gate-netlist's digital (boolean 0/1) behavior, accurate at boolean-level.

3. Behavioral Simulation V high-level simulation of a design's architectural operation, accurate at cycle-level or interface-level.

4. Hardware emulation V Use of special purpose hardware to emulate the logic of a proposed design. Can sometimes be plugged into a system in place of a yet-to-be-built chip; this is called in-circuit emulation.

5. Technology CAD simulates and analyzes the underlying process technology. Electrical properties of devices are derived directly from device physics.

6. Electromagnetic field solvers, or just field solvers, solve Maxwell's equations directly for cases of interest in IC and PCB design. They are known for being slower but more accurate than the layout extraction above.

Analysis and Verification

1. Functional verification

2. Clock Domain Crossing Verification (CDC check): Checks/tools specialize in detecting and reporting potential issues like data loss, meta-stability due to use of multiple clock domains in the design.

3. Formal verification, also model checking: Attempts to prove, by mathematical methods, that the system has certain desired properties, and that certain undesired effects (such as deadlock) cannot occur.

4. Equivalence checking: algorithmic comparison between a chip's RTL-description and synthesized gate-netlist, to ensure functional equivalence at the logical level.

5. Static timing analysis: Analysis of the timing of a circuit in an input-independent manner, hence finding a worst case over all possible inputs.

6. Physical verification, PV: checking if a design is physically manufacturable, and that the resulting chips will not have any function-preventing physical defects, and will meet original specifications.

Manufacturing Preparation

1. Mask data preparation, MDP: generation of actual lithography photomask used to physically manufacture the chip. Resolution enhancement techniques, RET V methods of increasing of quality of final photomask.

2. Optical proximity correction, OPC V up-front compensation for diffraction and interference effects occurring later when chip is manufactured using this mask.

3. Mask generation V generation of flat mask image from hierarchical design.

4. Automatic test pattern generation, ATPG V generates pattern-data to systematically exercise as many logic-gates, and other components, as possible.

5. Built-in self-test, or BIST V installs self-contained test-controllers to automatically test a logic (or memory) structure in the design.

 

Design Center and Tools - We assist our customer with all their connector and LAN module component needs.

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