Xmultiple has an advanced solution for EMI reduction for
10GB applications.Before the XTFZ transformers the metal
shielding use with 10Gb products was external to the transformer
component chip. The Xmultiple 10Gb XTFZ integrates the
metal shielding inside the component itself so the metal
shielding is contained inside the housing of component.
Other elements of the component such as coils and contact
pads and pins are also inside the component chip and the
metal shielding is position inside to shield the coils
in a manner to completely reduce the electromagnetic interference.