Tin Whiskers Information and Xmultiple Tin Whiskers Statement


From Xmultiple Engineering Dept.

Tin whiskers can occur when ˇ§pureˇ¨ tin plating is used on connectors. This is very rare however for tin whiskers to form. The primary reason in which lead is added to tin plating is to reduce the possibility of tin whisker from growing. However, tin whiskers are an industry-wide issue not restricted to any one company. All connector products have the risk for the formation of tin whiskers and therefore, a number of techniques are used by connector manufacturers which include tin free plating, the use of low stress tin, nickel under-plating and hot-dipping solder terminations coated with tin alloy with Sn-Ag-Cu or Sn-Cu.

In most environments Tin Whiskers would not be a likely issue to occur. However, for certain applications where any possible tin whisker will form this can be avoid with the use of lead free plating, such as gold flash, which have no possibility of tin whisker formation.

JEDEC standard JESD22A121 "Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes" was established by JEDEC for Tin Whiskers. Xmultiple uses third party laboratory testing to ensure that Xmultiple products contain lead-free plating (Tin >95 percent which includes Sn or Sn alloys such as SN-Ag-Cu and Sn-Cu) which meets the industry standards regarding Tin Whisker growth.


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