(Association Connecting Electronic Industries)
created and released IPC-M-109, Moisture-sensitive
Component Standards and Guideline Manual.
Moisture Sensitivity Level relates to
the packaging and handling precautions
for some semiconductors. The MSL is an
electronic standard for the time period
in which a moisture sensitive device can
be exposed to ambient room conditions
Increasingly, semiconductors have been
manufactured in smaller sizes. Components
such as thin fine-pitch devices and ball
grid arrays could be damaged during SMT
reflow when moisture trapped inside the
The expansion of trapped moisture can
result in internal separation (delamination)
of the plastic from the die or lead-frame,
wire bond damage, die damage, and internal
cracks. Most of this damage is not visible
on the component surface. In extreme cases,
cracks will extend to the component surface.
In the most severe cases, the component
will bulge and pop. This is known as the
Moisture sensitive devices are packaged
in a moisture barrier antistatic bag with
a desiccant and a moisture indicator card
which is vacuum sealed.
IPC-M-109 includes seven documents. According
to IPC/JEDEC's J-STD-20: Moisture/Reflow
Sensitivity Classification for Plastic
Integrated Circuit (IC) SMDs, there are
eight levels of moisture sensitivity.
Components must be mounted and reflowed
within the allowable period of time (floor
life out of the bag).
below are the MSL levels and the Jedec
standard table with time and conditions.
Xmultiple RJ connectors series without
transformers are classified as MSL 1.
For other connector types and series please
contact us with the Xmultiple part number.
MSL 1 - Unlimited
2 - 1 year
2A - 4 weeks
3 - 168 hours
4 - 72 hours
5 - 48 hours
5A - 24 hours
6 - Mandatory Bake before use