Open and Closed Case Resin Enclosures on Components


Xmultiple's Engineering Department

Xmultiple uses both open and closed resin case enclosures for our components. Open Case has no disadvantage over the closed case and features are listed below.

Potting compound of epoxy resin for electronic components


Resin is a two component, modified, medium viscosity epoxy potting compounds. It is used as electrical/electronic potting, casting and encapsulating. The elastic and low shrinkage characteristics are best suited for sensitive electrical and electronic components however it is not required on the bottom of the component which is being solder to a printed circuit board. The bottom on the resin of the component adds no advantage. The printed circuit board provides the thermal and mechanical shock resistance that the resin provides on the sides and top of the component.

Features of the electronic component resin

1. The resin is elastic, offering excellent thermal and mechanical shock resistance. Printed circuit boards on the bottom of the open case component provides this themal and mechanical shock resistance.

2. Flame retardant recognized under UL-94v0. Printed Circuit boards are also UL-94v0 flame retardant.

3. Easy handling of component by use of resin.

4. Good adhesive strength when applied to a printed circuit board.

5. Excellent chemical resistance and water resistance. Printed circuit boards which cover the bottom of an open case provide this same chemical and water resistance. In addition products manufactured with printed circuit boards should not be placed near liquids such as chemicals or water.




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