Potting compound of epoxy resin for electronic
is a two component, modified, medium viscosity
epoxy potting compounds. It is used as electrical/electronic
potting, casting and encapsulating. The elastic
and low shrinkage characteristics are best suited
for sensitive electrical and electronic components
however it is not required on the bottom of the
component which is being solder to a printed circuit
board. The bottom on the resin of the component
adds no advantage. The printed circuit board provides
the thermal and mechanical shock resistance that
the resin provides on the sides and top of the
Features of the electronic component resin
The resin is elastic, offering excellent thermal
and mechanical shock resistance. Printed circuit
boards on the bottom of the open case component
provides this themal and mechanical shock resistance.
Flame retardant recognized under UL-94v0. Printed
Circuit boards are also UL-94v0 flame retardant.
Easy handling of component by use of resin.
Good adhesive strength when applied to a printed
Excellent chemical resistance and water resistance.
Printed circuit boards which cover the bottom
of an open case provide this same chemical and
water resistance. In addition products manufactured
with printed circuit boards should not be placed
near liquids such as chemicals or water.