Methods for Xmultiple Terminal Blocks and Header Connectors-
Solder Reflow Temperature Charts
are industry designed solder-reflow profiles which provide
the optimum method for processing SMD package types for
both traditional SnPb solders and for Pb-free solders. The
maximum temperatures used for Pb-free solder processes tend
to be higher than the traditional SnPb processing temperatures.
Charts listed below show a typical higher temperature solder-reflow
profile for SMD packages using traditional SnPb solder.
Solding Method Charts for Header Connectors and Termainal
Blocks in the charts listed below provide a typical maximum
solder-reflow profile for SMD packages, using Pb-free solders.
Comparison of the two figures reveals the extent to which
Pb-free processing may require higher maximum process temperatures.
Reflow soldering of through-hole devices is acceptable,
as long as the plastic body of the device is not exposed
to excessive temperatures. Exceptions to the above are the
SA and SB package types, which have a thermoplastic housing
that can deform if exposed to such high temperatures. If
it is necessary to perform a reflow process on these packages,
a special protective pallet must be built to shield the
SA and SB packages so that the temperature of the housings
not exceed 170¢XC.
Methods for Xmultiple Terminal Blocks
Methods for Xmultiple Header Connectors