On Board LEDs
LED technology describes the mounting of a bare LED
chip in direct contact with the substrate to produce
LED arrays. It is a method of LED packaging which has
a number of advantages over traditional surface mount
technologies such as the use of ˇ§T-packˇ¨ and Surface
Due to the small size of the LED chip, Chip-on-Board
technology allows for a much higher packing density
than surface mount technology. This results in higher
intensity & greater uniformity for the user.
Drawings for all Xmultiple Chip-On-Board LED are available
upon request. Xmultiple manufacturers a range of solderless
solutions for mounting LED COB arrays.